This 2-layer FR4 PCB balances space efficiency with robust performance for industrial control modules, sensor nodes, and low-power automation systems. With dimensions of 98.45×79.69mm and a 1.6mm d'épaisseur, the board offers a versatile platform for integrating microcontrollers, communication interfaces, and power components in a compact form factor. Constructed from FR4 material, it ensures stable electrical insulation (dielectric constant εr=4.5) and mechanical rigidity, suitable for operation in moderate-temperature industrial environments.
- 2-Layer Stackup:
- Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression.
- Split power domains (Par exemple, 5V/3.3V) separated by isolation traces to minimize cross .
- 1Oz (35μm) Copper Thickness:
- Supports up to 8A current in power traces (≥1mm width) and fine-line routing (min line/space: 100μm/100μm) for signal integrity.
- Copper pour areas on both layers reduce thermal hotspots in power-critical sections.
- Green LPI Solder Mask:
- Standard industrial color for easy visual inspection and component identification.
- Chemical resistance against common industrial contaminants and cleaning agents.
- ENIG Surface Finish:
- 3–5μm nickel layer prevents corrosion; 0.05–0.1μm gold layer ensures reliable solder joints for both SMT and DIP components.
- SMT+DIP Mixed Assembly:
- Smt: Accommodates 0402 passive components, SOIC/SSOP ICs, and 0.5mm pitch QFP packages.
- DIP: Supports through-hole connectors (Par exemple, 0.1″ headers, terminal blocks) and relays for field wiring.
- Precision Fabrication:
- Laser direct imaging (LDI) for 100μm trace accuracy; electrolytic copper plating with uniform thickness verification.
- V-cut scoring for optional panelization in high-volume orders.
- Rigorous Testing:
- 100% automated optical inspection (AOI) for solder mask coverage and silkscreen clarity.
- Flying probe testing for electrical continuity (≤0.1Ω) and isolation (≥100MΩ).
- Tests de contrainte thermique (260°C reflow cycles) to ensure solder joint reliability.
- Standards Compliance:
- IPC-6012 Class 2 for industrial electronics; RoHS/REACH compliant for lead-free manufacturing.
- Industrial Sensor Nodes:
Integrates temperature/humidity sensors, analog-to-digital converters, and wireless modules (Zigbee/Bluetooth).
- Motor Driver Modules:
Manages low-voltage DC motors with PWM control, current sensing, and overheat protection.
- Communication Interfaces:
Enables RS-232/485 to USB conversion or simple protocol bridges for legacy industrial equipment.
- Power Distribution Blocks:
Distributes 24V DC to multiple loads with circuit protection and status indication.
