4-Capa FR4 TG150 PCB está diseñada para aplicaciones que requieren un equilibrio de capacidad de alta corriente, Integridad de señal, y fabricación rentable, como los sistemas de control industrial, módulos automotrices, y fuentes de alimentación. Construido a partir de FR4 TG150 Material (Temperatura de transición de vidrio 150 ° C), La PCB ofrece un rendimiento eléctrico estable y una durabilidad mecánica en entornos de temperatura moderada. El 2.0MM GRISIÓN Proporciona un soporte estructural robusto para componentes o aplicaciones pesadas sujetas a vibraciones, mientras el 4-arquitectura de capa (2 capas de señal + 2 aviones de potencia/terreno) minimiza la interferencia electromagnética (EMI) y permite una distribución de energía eficiente.
El 2ONZ (70μm) espesor de cobre En todas las capas admite cargas de alta corriente (hasta 15a por rastro), Haciéndolo ideal para circuitos hambrientos de energía como conductores de motor, LED controllers, and battery management systems. Designed in a 1×2 panel format, the PCB optimizes production for medium-volume orders, reducing material waste and simplifying assembly. Each panel contains two identical boards, connected by breakaway tabs for easy depaneling without damaging circuitry.
El Green LPI solder mask protects the copper traces from environmental damage (moisture, chemicals, and oxidation), mientras el White silkscreen ensures clear component marking and reference designations for assembly and maintenance. El Aceptar (Oro de inmersión de níquel electroutolante) surface treatment enhances solderability with a smooth, corrosion-resistant finish: the nickel layer (3–5μm) agrega durabilidad, and the gold layer (0.05–0.1μm) prevents oxidation, maintaining reliable connections over the product lifecycle.
Manufacturing processes focus on precision and quality control:
- DFM analysis optimizes layer stacking and panelization to ensure uniform copper distribution and minimal thermal stress.
- Enchapado de cobre electrolítico achieves consistent 2OZ thickness across all layers, Verificado por análisis transversal.
- 100% AOI (Inspección óptica automatizada) checks for solder mask defects, silkscreen clarity, and surface imperfections.
- Electrical testing verifies continuity and isolation resistance, meeting IPC-6012 Class 2 estándares.
- Prueba de estrés térmico (reflow cycles at 260°C) ensures the PCB withstands harsh assembly conditions.
Engineers will appreciate the PCB’s versatility in handling both power and signal applications. In industrial settings, it supports complex control panels with mixed high-current and low-voltage signals. In automotive systems, the TG150 material and ENIG finish ensure reliability in under-hood environments. For consumer electronics, the 1×2 panel format balances production efficiency with design flexibility for power adapters and charging modules.
By choosing this 4-layer FR4 TG150 PCB, customers gain a solution that merges 2OZ copper performance, panelized manufacturing, and ENIG reliability. Respaldado por ISO 9001:2015 certification and RoHS compliance, it delivers consistent quality from prototype to mass production—an ideal choice for projects requiring robust power handling, cost-effective scaling, and long-term operational stability.
