This 6-layer FR4 TG170 PCB is a high-performance printed circuit board engineered for industrial automation, communication modules, and mission-critical electronic systems that demand superior thermal stability, signal integrity, and mechanical durability. With a 1.6mm thickness, 1OZ copper on all layers, and an ENIG surface finish, the board balances robust power handling with fine-pitch routing capabilities, making it ideal for applications ranging from industrial control panels to 5G communication devices and medical equipment.
Constructed from FR4 material with a glass transition temperature (Tg) of 170°C, the PCB withstands prolonged exposure to elevated temperatures in harsh industrial environments, such as factory floors, outdoor communication hubs, or automotive systems. The 6-layer architecture—featuring 4 signal layers and 2 dedicated power/ground planes—minimizes electromagnetic interference (EMI) and enables efficient separation of high-speed signals (e.g., Ethernet, CANbus) from power circuits. This design ensures stable signal transmission for applications requiring real-time data processing, such as programmable logic controllers (PLCs), industrial IoT gateways, or wireless base stations.
A key feature of this PCB is the gold finger with a 2 microinch (0.05μm) gold thickness, providing exceptional corrosion resistance and reliable electrical contact in pluggable connectors. The gold plating enhances wear resistance during mating cycles, making it suitable for applications requiring frequent board insertion/removal, such as modular industrial systems or rack-mounted communication equipment. The ENIG (Electroless Nickel Immersion Gold) surface finish further ensures long-term solderability and wire bonding compatibility, with a 3-5μm nickel barrier layer preventing copper oxidation and a thin gold layer optimizing soldering precision for fine-pitch components (down to 0.5mm pitch).
The PCB undergoes a rigorous fabrication process to ensure precision and reliability:
- Inner Layer Processing: Laser direct imaging (LDI) defines 75μm line/space patterns on 1OZ copper cores, followed by etching to form the inner circuitry.
- Drilling & Plating: High-precision mechanical drilling creates vias, which are then processed through PTH (plated through hole) with electroless and electrolytic copper plating to achieve uniform 35μm thickness, ensuring robust through-hole conductivity.
- Outer Layer Pattern Transfer: Dry film lamination and exposure define the outer layer traces, followed by pattern plating and tin masking to protect conductive areas during etching.
- Surface Finishing: The ENIG process applies a consistent nickel-gold coating, while the green LPI solder mask provides chemical resistance and visual clarity for component identification.
- E-Test & Quality Control: 100% electrical testing verifies continuity (≤0.1Ω) and isolation (≥100MΩ), while automated optical inspection (AOI) ensures solder mask coverage and gold finger integrity. Notably, X-out panels are strictly rejected during quality checks to eliminate defective boards from production.
- Industrial Control Systems: Supports PLCs and motor drives with stable power distribution and high-speed signal routing for real-time control.
- 5G & Wireless Communication: Enables RF signal integrity in 5G sub-6GHz modules and Wi-Fi 6 access points, thanks to controlled impedance (50Ω ±8%) and layer stackup optimization.
- Medical Devices: Meets biocompatibility requirements for diagnostic equipment, with lead-free compliance (RoHS/REACH) and low outgassing materials.
- Aerospace & Defense: Withstands vibration and temperature cycling (-40°C to +85°C) in avionics and ruggedized electronic systems.
The PCB’s TG170 material, 6-layer architecture, and gold finger design collectively offer:
- Thermal Stability: Reduces delamination risks in high-temperature environments compared to standard FR4 (Tg130°C).
- Reliable Interconnects: Gold fingers ensure low contact resistance and long service life in dynamic mating applications.
- Design Flexibility: Supports mixed technology assembly (SMT/DIP) and accommodates components from 0402 passives to QFP/BGA packages.
Compliant with IPC-6012 Class 2 standards, this 6-layer FR4 TG170 PCB delivers consistent quality for mid-to-high-volume production. Its combination of thermal performance, signal integrity, and robust mechanical design makes it a strategic choice for engineers developing next-generation industrial and communication systems that require reliability, scalability, and compliance with global standards. Whether used in smart factory automation, telecommunications infrastructure, or advanced medical devices, this PCB provides the foundation for innovative, high-performance electronics.
