This double-sided PCB is engineered specifically for automotive applications, where reliability, thermal performance, and compliance with industry standards are critical. Constructed from FR4 material with a 1.6mm thickness, it provides a robust foundation for automotive electronics, balancing mechanical stability with thermal dissipation. The 3OZ (105μm) copper weight on both sides significantly enhances current-carrying capacity (up to 20A per trace), making it ideal for high-power automotive circuits such as motor controls, LED lighting drivers, and power distribution modules.

 

The LPI (Liquid Photoimageable) Matt Green solder mask offers several advantages tailored to automotive needs. Its matte finish reduces glare during automated optical inspection (AOI), improving defect detection accuracy. The liquid-based application ensures uniform coverage, even on complex trace patterns, while providing excellent protection against environmental factors such as moisture, chemicals, and abrasion—common challenges in automotive environments. The OSP (Organic Solderability Preservative) finish provides a thin, protective coating that preserves solderability during assembly while meeting automotive requirements for lead-free and RoHS-compliant materials. OSP is particularly well-suited for automotive applications due to its compatibility with multiple soldering processes (wave, reflow, and selective soldering) and its ability to maintain solder joint integrity over time.

 

Manufactured under IATF16949 certification—the global standard for automotive quality management—the PCB undergoes rigorous testing and inspection at every stage. This includes:

 

  • Automated optical inspection (AOI) to detect surface defects, such as pinholes or solder mask bridging.
  • Electrical testing to verify continuity and isolation resistance, ensuring compliance with automotive electrical safety standards.
  • Thermal stress testing (e.g., multiple reflow cycles at 260°C) to simulate the harsh soldering conditions encountered in automotive assembly.
  • Solderability testing to ensure the OSP finish maintains its effectiveness throughout the PCB’s shelf life (typically 6-12 months).

 

Engineers designing automotive systems will appreciate the PCB’s ability to handle the unique challenges of vehicle environments. The 3OZ copper thickness minimizes resistive heating in high-current applications, reducing the risk of thermal failure. The LPI solder mask’s matte finish and durability ensure long-term protection against corrosion and mechanical damage. The OSP finish, combined with IATF16949 compliance, provides confidence in the PCB’s reliability and traceability—a critical requirement for automotive manufacturers subject to strict quality control and recall management.

 

Whether used in engine control units, battery management systems, or advanced driver-assistance systems (ADAS), this double-sided PCB delivers the performance and compliance needed for automotive applications. Its combination of 3OZ copper, LPI Matt Green solder mask, and OSP finish, backed by IATF16949 certification, makes it a trusted choice for automotive electronics suppliers seeking to meet the industry’s highest standards for quality and reliability.

PCB Capability


Item Standard PCB Customized PCB
Number of Layers 2-20 2-50
Material FR4 Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers etc.
PCB thickness 0.4-3.2mm 0.4-6.4mm
Copper Weight HOZ-3OZ HOZ-10OZ
Min. Hole Diameter 0.3mm 0.1mm by Laser Drill
PCB Size Min. 6.00X6.00mm Max. 600.00X620.00mm
PCB Finish HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Min.Soldermask Dam. 4mils for 1OZ 2.5mils for 1OZ
Prepreg Type 2116,1080 2116,1080,7628,3313,106
Min.Width/Space 4/4 mils 2.5/2.5 mils
Min. Annular Ring 4/4 mils 2.5/2.5 mils
Aspect Ratio 8:1 15:1
Lead Time 2 weeks 5 Days - 5 Weeks
Impedance Tolerance ±5% - ±10% ±5% - ±10%
Other Techniques Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon Mask, Countersink hole,
Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad (VIP, POFV), Multi-finishes on one PCB

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PCBA Capability


No. Item Process Capability Parameter
1 Order Quantity More than 1pcs
2 PCB Type Rigid PCB, FPC, Rigid-flex PCB
3 Assembly Tech SMT, THT, Mixed Tech or POP
4 Component Sourcing Full Turnkey, Partial Turnkey, Consigned
5 PCB Size 45*45mm -- 510*500mm
6 BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
7 Parts Presentation Tape, Reel, Stick or Tray
8 Wire & Cable Wire harness and Cable Assembly
9 Quality Inspection Visual, SPI, FAI, AOI; X-RAY checking
10 Mounting Accuracy ±0.035mm (±0.025mm)
11 Min Package 01005 (0.4mm*0.2mm)
12 Conformal Coating Available by machine
13 IC Inspection Function, Electrical or Decap Test
14 Lead Time 3 days - 5 Weeks
15 Other Techniques Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom,
Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework,
Shield cover assembly for EMI emission control

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FPC Capability


No. Item Process Capability Parameter
1 Layer Count 1-8 Layers
2 FPC Material PI, PET, PEN, FR-4
3 Final Thickness 0.06-4.0mm
4 Board Size 250.00X1200mm
5 Copper Foil 12um,18um,35um,70um
6 Min width/Space 3mil/3mil
7 Holewall Copper Thickness 8-20μm
8 Surface Treatment HAL leadfree, ENIG, Immersion Silver/Tin, OSP
9 Outlines Dimension ±2mils
10 Solder Heat Resistance 280℃ / 10secs
11 Stiffener Type PI, FR4, Stainless Steel, Aluminum
12 Min. Hole Dia (PTH) 0.1mm±3mils
13 Min. Hole Dia (NPTH) 0.25±2mils
14 Max/Min Soldermask Thickness 2mil/0.5mil (50um/12.7um)
15 Min Slot 0.8mm×1mm

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