8-Lớp FR4 PCB: The Core Board for Industrial Communication

This 8-layer FR4 PCB is specifically engineered for demanding industrial communication applications, providing a stable and reliable foundation for industrial control cabinets, communication gateways, and automation systems. With dimensions of 174.52×121.25mm and a thickness of 1.6mm, the board balances mechanical stability with the ability to integrate a large number of critical components. From excellent signal integrity to a durable build, this PCB is designed to deliver reliable performance in harsh environments with vibration, temperature fluctuations, và nhiễu điện từ.

Các tính năng kỹ thuật chính

1. Advanced Stackup and Signal Integrity

• 8-Layer Stackup: The design features four signal layers and four power/ground planes. This architecture effectively suppresses EMI (Electromagnetic Interference) and provides optimized routing paths for high-speed differential pairs like Ethernet and CANopen.
• Precision Impedance Control: Differential line impedance is controlled at 100Ω±8%, while single-ended line impedance is controlled at 50Ω±8%. This minimizes signal reflection and ensures the integrity of high-speed interfaces like Gigabit Ethernet.
• 1Oz (35μm) Copper Thickness: The copper thickness balances the needs of fine-line routing (minimum line/space: 75μm/75μm) with a high current-carrying capacity of up to 10A, supporting high-power and high-density designs.

2. Industrial-Grade Design and Manufacturing

• Đồng ý (Điện phân Niken Vàng) Surface Finish: The finish provides a nickel layer of 4–6μm and a gold layer of 0.05Cấm0,1mm. The nickel layer offers excellent corrosion resistance, while the gold layer ensures long-term solderability and wire bonding compatibility, guaranteeing reliable, long-lasting connections.
• Blue LPI Solder Mask: The blue ink not only effectively protects circuitry and prevents oxidation but also provides excellent visual differentiation in complex systems, making identification and maintenance easier.
• Mixed Assembly Compatibility: The board supports both SMT (Surface-Mount Technology) for high-density ICs (e.g., PHY chips, FPGAs) Và DIP (Dual In-line Package) for rugged connectors (RJ45, DB25) and relays, combining high integration with durability.
• High-Precision Manufacturing: We use LDI (Hình ảnh trực tiếp bằng laser) technology for 75μm trace accuracy. The electrolytic copper plating process ensures thickness uniformity within ±5%, guaranteeing consistent trace performance.

Quality and Compliance

• Comprehensive Quality Control:
  • 100% Electrical Testing (E-Test): This ensures the continuity of all circuits during the manufacturing stage.
  • Kiểm tra quang học tự động (Aoi): Used to detect defects on the bare board, such as shorts and opens.
  • X-ray Inspection: Verifies the solder joint quality of BGA packages to ensure there are no voids or bridges.
• Environmental and Industry Standards:
  • Compliant with the IPC-6012 Class 2 standard for industrial applications.
  • RoHS/REACH certified, adhering to hazardous substance restrictions.
  • ISO 9001:2015 certified, providing a guarantee of our quality management system.

Typical Applications

• Industrial Ethernet Networks: Provides a low-latency, low-jitter high-speed transmission platform for 10/100/1000Mbps Ethernet communication.
• PLC & SCADA Systems: Supports real-time data exchange and control in manufacturing facilities.
• Railway Communication Systems: Compliant with the EN 50155 standard, ensuring stable operation in harsh rail environments.
• Wireless Base Stations: Provides reliable RF signal routing for 5G sub-6GHz and Wi-Fi 6 applications.

With its precise stackup design, superior electrical performance, and robust industrial-grade features, this PCB is the ideal choice for building high-performance, highly reliable industrial communication systems.