8-layer FR4 PCB is engineered for high-density electronic designs that require a balance of signal integrity, power distribution, and compact form factors, such as consumer electronics, medical devices, and industrial control modules. Các 8-Kiến trúc lớp (typically 4 Lớp tín hiệu + 4 Máy bay điện/mặt đất) enables complex routing for fine-pitch components while minimizing electromagnetic interference (Emi). Các 1.2mm board thickness offers a lightweight yet rigid foundation, ideal for space-constrained applications where weight and durability are critical.
Constructed with FR4 material, the PCB provides reliable electrical insulation (Hằng số điện môi εr = 4,5) and mechanical stability, suitable for a wide range of operating environments. Các 2Oz (70μm) Độ dày đồng on all layers enhances current-carrying capacity (lên đến 15a mỗi dấu vết) while maintaining design flexibility for both power and signal traces. Các Green LPI (Liquid Photoimageable) solder mask not only protects the circuitry from environmental damage but also improves visual inspection accuracy, Trong khi Silkscreen trắng ensures clear component marking and designations for assembly and maintenance.
A key feature is the Đồng ý (Điện phân Niken Vàng) surface treatment, which provides a smooth, corrosion-resistant finish for excellent solderability. The nickel layer (3Mạnh5μm) Thêm độ bền, và lớp vàng (0.05Cấm0,1mm) ngăn chặn quá trình oxy hóa, making it suitable for long-term use. Các POFV (Plated Over Filled Vias) technology further enhances the PCB’s reliability: vias are filled with conductive material and plated over, eliminating voids that could cause thermal stress or solder wicking. This is particularly important for high-density designs with fine-pitch components (e.g., 0.5mm pitch BGAs) and ensures consistent performance in reflow soldering processes.
Manufacturing this PCB involves advanced techniques to ensure precision and quality:
- Hình ảnh trực tiếp bằng laser (LDI) achieves fine-line accuracy (Chiều rộng/không gian dòng tối thiểu: 50μm/50μm) for complex routing.
- POFV processing uses conductive epoxy or resin to fill vias, followed by plating to create a smooth surface.
- 100% Aoi (Kiểm tra quang học tự động) verifies solder mask coverage and silkscreen clarity.
- Thử nghiệm điện ensures continuity and isolation resistance, Gặp gỡ lớp IPC-6012 2 tiêu chuẩn.
Engineers will appreciate the PCB’s versatility in handling both high-density signal routing and moderate power applications. In consumer electronics, it supports compact designs for smartphones, tablets, and wearables, where space is at a premium. In medical devices, the POFV technology and ENIG finish contribute to long-term reliability in diagnostic equipment. In industrial systems, the 2OZ copper and FR4 material provide the durability needed for control panels and automation modules.
By choosing this 8-layer FR4 PCB with 2OZ copper, ENIG finish, and POFV technology, customers gain a solution that balances density, độ tin cậy, and cost-effectiveness. Its combination of advanced via filling, premium surface treatment, and precise manufacturing makes it a strategic choice for applications where component integration and long-term performance are essential. Được hỗ trợ bởi ISO 9001:2015 certification, this PCB ensures consistent quality from prototyping to mass production.
