This double-sided FR4 TG170 PCB is a versatile and cost-effective solution designed for a wide range of applications, from industrial control systems to consumer electronics and medical devices. Built with a 1.6mm thickness, 1OZ copper layers, and a lead-free HAL (Hot Air Levelling) surface finish, the board balances mechanical robustness, electrical reliability, and environmental compliance, making it ideal for projects that require high performance at scale.
Constructed from FR4 material with a glass transition temperature (Tg) of 170°C, this PCB offers superior thermal stability compared to standard FR4 (Tg130°C), ensuring reliable operation in environments with moderate temperature fluctuations (Örn., -20°C to +80°C). The double-sided design maximizes component density while minimizing board size, allowing engineers to route complex circuitry efficiently with dual-layer signal traces and ground/power planes implemented via copper pours. This layout reduces electromagnetic interference (EMI) and supports basic signal integrity for low-to-medium-speed applications, such as microcontroller-based systems, sensor interfaces, and simple communication modules.
- Lead-Free HAL Surface Finish:
The lead-free HAL finish provides a smooth, uniform coating of tin (Sn) over the copper pads, ensuring excellent solderability for both manual and automated assembly. This compliant with RoHS/REACH standards, making it suitable for global markets. The finish offers good corrosion resistance and is ideal for applications requiring frequent rework or field repairs, such as industrial maintenance systems or consumer electronics with high repair rates.
- 1OZ Copper Thickness:
The 35μm (1Oz) copper layers support moderate current loads (up to 8A per wide trace) and enable fine-line routing (minimum line/space: 100μm/100μm), balancing power delivery with component density. Copper pours on both layers enhance thermal dissipation, reducing hotspots in power-critical sections like voltage regulators or motor drivers.
- Green LPI Solder Mask:
The standard green solder mask not only provides visual clarity for component identification and rework but also offers chemical resistance against common contaminants, including oils, coolants, and cleaning agents. This makes the PCB suitable for industrial environments where exposure to harsh substances is frequent, such as manufacturing plants or outdoor equipment.
The PCB undergoes a rigorous fabrication process to ensure consistency and reliability:
- Drilling: High-precision mechanical drilling creates vias with ±50μm accuracy, accommodating through-hole components and dual-layer connectivity.
- Pth (Plated Through Hole): Vias are coated with electroless and electrolytic copper (25-35μm thickness) to ensure robust electrical connections between layers.
- Dry Film Lamination & Imaging: A photosensitive dry film is applied and exposed to define trace patterns via UV lithography, achieving 100μm line/space resolution.
- Pattern Plating & Etching: Tin plating protects conductive traces during etching, which removes excess copper to form the final circuitry.
- Lehim maskesi & Surface Finish: The green LPI solder mask is applied via screen printing and cured at 150°C for durability, followed by lead-free HAL plating to enhance solder wetting.
- E-Test & Inspection: 100% electrical testing verifies continuity (≤0.1Ω) and isolation (≥100MΩ), while automated optical inspection (AOI) checks for solder mask coverage, trace defects, and registration accuracy. X-out panels are strictly rejected to ensure only defect-free boards proceed to shipment.
- Industrial Control Systems:
Ideal for simple PLC modules, relay control boards, or sensor interface units, where cost-effectiveness and reliability are prioritized over extreme density.
- Consumer Electronics:
Supports low-power devices like smart home sensors, wearables, or Bluetooth audio modules, with compact layouts and easy-to-access test points for debugging.
- Medical Devices:
Suitable for basic diagnostic equipment or monitoring devices, thanks to RoHS compliance and stable electrical performance in medical environments.
- Education & Prototyping:
A popular choice for academic projects or rapid prototyping due to its balanced performance, affordability, and compatibility with standard SMT/DIP components (Örn., 0402 passives, SOIC ICs, through-hole connectors).
- Standards Met:
- IPC-6012 Class 2 for general-purpose industrial applications.
- RoHS/REACH compliant for lead-free and hazardous substance restrictions.
- Environmental Testing:
Termal stres testi (260°C reflow cycles) and vibration resistance (5-500Hz) ensure the PCB withstands typical assembly and operational conditions.
By combining a robust TG170 substrate, lead-free HAL finish, and double-sided design, this PCB offers a reliable foundation for electronics that require a balance of performance, cost, and scalability. Its straightforward architecture and rigorous quality control make it an excellent choice for engineers developing mid-complexity systems in industrial, consumer, or medical sectors, where consistent performance and compliance with global standards are essential. Whether used in mass-produced consumer devices or custom industrial modules, this double-sided FR4 TG170 PCB delivers dependable functionality at an accessible price point.
