8-layer FR4 PCB is engineered for high-density electronic designs that require a balance of signal integrity, power distribution, and compact form factors, such as consumer electronics, medical devices, and industrial control modules. . 8-katman mimarisi (typically 4 sinyal katmanları + 4 Güç/Zemin Uçakları) enables complex routing for fine-pitch components while minimizing electromagnetic interference (EMI). . 1.2mm board thickness offers a lightweight yet rigid foundation, ideal for space-constrained applications where weight and durability are critical.
Constructed with FR4 material, the PCB provides reliable electrical insulation (Dielektrik sabiti εr = 4.5) and mechanical stability, suitable for a wide range of operating environments. . 2Oz (70μm) bakır kalınlığı on all layers enhances current-carrying capacity (İz başına 15a'ya kadar) while maintaining design flexibility for both power and signal traces. . Green LPI (Liquid Photoimageable) solder mask not only protects the circuitry from environmental damage but also improves visual inspection accuracy, iken Beyaz ipek ensures clear component marking and designations for assembly and maintenance.
A key feature is the Kabul etmek (Elektroles Nikel Daldırma Altın) surface treatment, which provides a smooth, corrosion-resistant finish for excellent solderability. The nickel layer (3–5μm) dayanıklılık ekler, Ve altın katman (0.05–0.1mm) oksidasyonu önler, making it suitable for long-term use. . POFV (Plated Over Filled Vias) technology further enhances the PCB’s reliability: vias are filled with conductive material and plated over, eliminating voids that could cause thermal stress or solder wicking. This is particularly important for high-density designs with fine-pitch components (Örn., 0.5mm pitch BGAs) and ensures consistent performance in reflow soldering processes.
Manufacturing this PCB involves advanced techniques to ensure precision and quality:
- Lazer Doğrudan Görüntüleme (LDI) achieves fine-line accuracy (Minimum çizgi genişliği/boşluk: 50μm/50μm) for complex routing.
- POFV processing uses conductive epoxy or resin to fill vias, followed by plating to create a smooth surface.
- 100% AOI (Otomatik Optik İnceleme) verifies solder mask coverage and silkscreen clarity.
- Elektrik Testi ensures continuity and isolation resistance, Buluşma IPC-6012 Sınıfı 2 standartlar.
Engineers will appreciate the PCB’s versatility in handling both high-density signal routing and moderate power applications. In consumer electronics, it supports compact designs for smartphones, tablets, and wearables, where space is at a premium. In medical devices, the POFV technology and ENIG finish contribute to long-term reliability in diagnostic equipment. In industrial systems, the 2OZ copper and FR4 material provide the durability needed for control panels and automation modules.
By choosing this 8-layer FR4 PCB with 2OZ copper, ENIG finish, and POFV technology, customers gain a solution that balances density, reliability, and cost-effectiveness. Its combination of advanced via filling, premium surface treatment, and precise manufacturing makes it a strategic choice for applications where component integration and long-term performance are essential. ISO tarafından desteklendi 9001:2015 certification, this PCB ensures consistent quality from prototyping to mass production.
