This 2-layer FR4 PCBA (Printed Circuit Board Assembly) is engineered for miniature electronic devices that demand a balance of reliability, conductivity, and assembly precision, such as wireless modules, giyilebilir elektronik, and medical sensors. With dimensions of 40mm×25mm and a 1.6mm kalınlığı, the board maximizes space efficiency while supporting dense surface-mount component placement. İnşa edildi FR4 material, it offers consistent electrical insulation and mechanical stability, suitable for commercial-grade applications with moderate temperature and humidity ranges.

 

. 1Oz (35μm) bakır kalınlığı on both layers optimizes signal integrity and current-carrying capacity (up to 8A per wide trace), ideal for battery-powered devices. . Red LPI solder mask provides a durable, moisture-resistant coating that protects circuitry while enabling visual differentiation in multi-board assemblies, iken Beyaz ipek ensures clear component marking for quality control and maintenance. . Kabul etmek (Elektroles Nikel Daldırma Altın) surface finish creates a corrosion-resistant, solder-friendly surface (3–5μm nickel, 0.05–0.1μm gold), ensuring reliable connections for fine-pitch components (down to 0.3mm pitch).

SMT Assembly Capabilities

  • Component Support:
    • 01005 ile 1206 passive components
    • QFP, BGA (0.5mm pitch), Ve 0201 ultra-small packages
    • Height restriction: ≤5mm for vertical clearance
  • Assembly Processes:
    • Lead-free reflow soldering (peak temperature: 260°C)
    • Automated optical inspection (AOI) for solder joint quality
    • X-ray inspection for BGA/CSP components
  • Testing Options:
    • In-circuit testing (ICT) for component functionality
    • Fonksiyonel test (FT) per customer specifications

4×5 Panel Format Advantages

  • Production Efficiency:
    • 20 identical boards per panel reduce material waste by 30%
    • Breakaway tabs with V-cut scoring for easy depaneling
  • Maliyet optimizasyonu:
    • Economies of scale for high-volume orders (10k+ units)
    • Shared setup costs across panels
  • Assembly Compatibility:
    • Compatible with standard pick-and-place machines (Örn., Yamaha, Juki)
    • Supports tape-and-reel component feeding

Kalite kontrolü & Uygunluk

  • Material Traceability:
    • RoHS-compliant components (lead-free, halogen-free)
    • UL 94V-0 flammability rating for FR4
  • Reliability Testing:
    • Thermal cycling (-40° C ila +85 ° C, 100 cycles)
    • Humidity testing (85°C/85% RH, 1,000 saat)
  • Standartlar karşılandı:
    • IPC-A-610 Class 2 for general electronics
    • ISO 9001:2015 quality management system

Başvuru

  • Kablosuz iletişim:
    Bluetooth/Wi-Fi modules for IoT gateways and smart home devices
  • Medical Diagnostics:
    Portable health monitors with compact sensor interfaces
  • Tüketici Elektroniği:
    Wearable fitness trackers and hearables with space-constrained designs
  • Industrial Sensors:
    Compact environmental sensors for predictive maintenance

 

By choosing this 2-layer FR4 PCBA, engineers gain a fully assembled solution that balances precision SMT placement, ENIG reliability, and panelized production. The red solder mask offers visual differentiation in complex systems, while the 4×5 panel format ensures cost-effective scaling from prototype to mass production. Backed by comprehensive testing and compliance, this PCBA delivers consistent performance for applications where size, cost, and quality are critical.