8-layer FR4 PCB is engineered for high-density electronic designs that require a balance of signal integrity, power distribution, and compact form factors, such as consumer electronics, medical devices, and industrial control modules. А 8-архитектура слоя (typically 4 Слои сигнала + 4 Силовая/основные плоскости) enables complex routing for fine-pitch components while minimizing electromagnetic interference (Эми). А 1.2MM Толщина доски offers a lightweight yet rigid foundation, ideal for space-constrained applications where weight and durability are critical.
Constructed with FR4 material, the PCB provides reliable electrical insulation (Диэлектрическая постоянная εr = 4,5) and mechanical stability, suitable for a wide range of operating environments. А 2Унция (70мкм) толщина меди on all layers enhances current-carrying capacity (до 15А за след) while maintaining design flexibility for both power and signal traces. А Green LPI (Liquid Photoimageable) solder mask not only protects the circuitry from environmental damage but also improves visual inspection accuracy, Пока Белый шелкосный экран ensures clear component marking and designations for assembly and maintenance.
A key feature is the Соглашаться (Электролетное никелевое погружение) surface treatment, which provides a smooth, corrosion-resistant finish for excellent solderability. The nickel layer (3–5 мкм) добавляет долговечность, И золотой слой (0.05–0,1 мм) предотвращает окисление, making it suitable for long-term use. А Пофв (Plated Over Filled Vias) technology further enhances the PCB’s reliability: vias are filled with conductive material and plated over, eliminating voids that could cause thermal stress or solder wicking. This is particularly important for high-density designs with fine-pitch components (НАПРИМЕР., 0.5mm pitch BGAs) and ensures consistent performance in reflow soldering processes.
Manufacturing this PCB involves advanced techniques to ensure precision and quality:
- Лазерная прямая визуализация (LDI) achieves fine-line accuracy (Минимальная ширина линии/пространство: 50μm/50μm) for complex routing.
- POFV processing uses conductive epoxy or resin to fill vias, followed by plating to create a smooth surface.
- 100% Аои (Автоматическая оптическая проверка) verifies solder mask coverage and silkscreen clarity.
- Электрические испытания ensures continuity and isolation resistance, Встреча с IPC-6012 2 стандарты.
Engineers will appreciate the PCB’s versatility in handling both high-density signal routing and moderate power applications. In consumer electronics, it supports compact designs for smartphones, tablets, and wearables, where space is at a premium. In medical devices, the POFV technology and ENIG finish contribute to long-term reliability in diagnostic equipment. In industrial systems, the 2OZ copper and FR4 material provide the durability needed for control panels and automation modules.
By choosing this 8-layer FR4 PCB with 2OZ copper, Загадка финишировать, and POFV technology, customers gain a solution that balances density, надежность, and cost-effectiveness. Its combination of advanced via filling, premium surface treatment, and precise manufacturing makes it a strategic choice for applications where component integration and long-term performance are essential. Окреплен ISO 9001:2015 certification, this PCB ensures consistent quality from prototyping to mass production.
