Industrial PLC control board revolutionizes automated system management by integrating precision isolation control with flexible power distribution, ideal for manufacturing lines, energy plants, and smart factory applications. The core design emphasizes 6 channels of PLC isolation control, each equipped with high-voltage optocoupler isolation (2500Vrms) to prevent electromagnetic interference (EMI) and ground loops—critical for maintaining signal integrity in noisy industrial settings. Each channel supports both NPN/PNP input signals and relay/output switching, accommodating a wide range of sensors, actuators, and control devices.

Key Technical Features

  • 6-Channel Isolation Control:
    • Optocoupler isolation with 2500Vrms breakdown voltage
    • Support for digital inputs (5-24V DC) and relay outputs (10A/250V AC)
    • Built-in transient voltage suppression (TVS) diodes to protect against surges
  • Multiple Power Outputs:
    • Dual isolated power rails:
      • 24V DC/5A (regulated for PLC modules)
      • 12V DC/3A (for sensors and low-power devices)
    • Switching power supply: 90-264V AC input with PFC, compatible with global voltage standards
    • Over-current/over-voltage/short-circuit protection for all outputs
  • Communication Interfaces:
    • RS485 (Modbus RTU) and RS232 for serial control
    • Ethernet (10/100Mbps) with Modbus TCP/IP protocol
    • Optional CANopen interface for industrial fieldbus networks

Industrial-Grade Design

  • Rugged Hardware:
    • 4-layer FR4 PCB with 1.6mm thickness and 2OZ copper for thermal stability
    • IP20-rated metal enclosure with anti-vibration mounting brackets
    • Operating temperature: -20°C to +70°C, humidity: 5-95% non-condensing
  • EMC Compliance:
    • Meets EN 61000-6-2 (industrial immunity) and EN 61000-6-4 (emission standards)
    • CE, UL, and RoHS certification for global industrial applications
  • Redundancy Features:
    • Dual power input options (AC and DC) with automatic failover
    • Battery-backed real-time clock (RTC) for event logging during power outages

Manufacturing & Quality Control

  • DFM-Optimized Layout:
    • Signal and power layers separated to minimize cross-talk
    • Thermal vias for efficient heat dissipation in high-power areas
  • Testing Protocols:
    • 100% functional testing under full load conditions
    • Burn-in testing for 72 hours at 85°C to ensure long-term reliability
    • Vibration testing (5-500Hz, 2G acceleration) to simulate industrial environments

Industrial Applications

  • Manufacturing Automation:
    Controls conveyor belts, robotic arms, and assembly lines in automotive, electronics, and food processing plants.
  • Process Control:
    Monitors and adjusts flow rates, pressures, and temperatures in chemical, pharmaceutical, and water treatment facilities.
  • Energy Management:
    Manages power distribution in smart grids, solar farms, and industrial battery storage systems.
  • Building Automation:
    Controls HVAC systems, lighting, and security in commercial buildings and industrial campuses.

 

By integrating 6-channel isolation control with diversified power outputs, this PLC control board enables engineers to build robust, interference-free automation systems. Its combination of high-voltage isolation, redundant power supplies, and industrial-grade durability makes it a strategic choice for mission-critical applications where downtime is not an option. Backed by a 3-year warranty and 24/7 technical support, this board ensures seamless integration into existing PLC networks while future-proofing systems for Industry 4.0 upgrades.

PCB Capability


Item Standard PCB Customized PCB
Number of Layers 2-20 2-50
Material FR4 Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers etc.
PCB thickness 0.4-3.2mm 0.4-6.4mm
Copper Weight HOZ-3OZ HOZ-10OZ
Min. Hole Diameter 0.3mm 0.1mm by Laser Drill
PCB Size Min. 6.00X6.00mm Max. 600.00X620.00mm
PCB Finish HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Min.Soldermask Dam. 4mils for 1OZ 2.5mils for 1OZ
Prepreg Type 2116,1080 2116,1080,7628,3313,106
Min.Width/Space 4/4 mils 2.5/2.5 mils
Min. Annular Ring 4/4 mils 2.5/2.5 mils
Aspect Ratio 8:1 15:1
Lead Time 2 weeks 5 Days - 5 Weeks
Impedance Tolerance ±5% - ±10% ±5% - ±10%
Other Techniques Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon Mask, Countersink hole,
Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad (VIP, POFV), Multi-finishes on one PCB

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PCBA Capability


No. Item Process Capability Parameter
1 Order Quantity More than 1pcs
2 PCB Type Rigid PCB, FPC, Rigid-flex PCB
3 Assembly Tech SMT, THT, Mixed Tech or POP
4 Component Sourcing Full Turnkey, Partial Turnkey, Consigned
5 PCB Size 45*45mm -- 510*500mm
6 BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
7 Parts Presentation Tape, Reel, Stick or Tray
8 Wire & Cable Wire harness and Cable Assembly
9 Quality Inspection Visual, SPI, FAI, AOI; X-RAY checking
10 Mounting Accuracy ±0.035mm (±0.025mm)
11 Min Package 01005 (0.4mm*0.2mm)
12 Conformal Coating Available by machine
13 IC Inspection Function, Electrical or Decap Test
14 Lead Time 3 days - 5 Weeks
15 Other Techniques Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom,
Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework,
Shield cover assembly for EMI emission control

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FPC Capability


No. Item Process Capability Parameter
1 Layer Count 1-8 Layers
2 FPC Material PI, PET, PEN, FR-4
3 Final Thickness 0.06-4.0mm
4 Board Size 250.00X1200mm
5 Copper Foil 12um,18um,35um,70um
6 Min width/Space 3mil/3mil
7 Holewall Copper Thickness 8-20μm
8 Surface Treatment HAL leadfree, ENIG, Immersion Silver/Tin, OSP
9 Outlines Dimension ±2mils
10 Solder Heat Resistance 280℃ / 10secs
11 Stiffener Type PI, FR4, Stainless Steel, Aluminum
12 Min. Hole Dia (PTH) 0.1mm±3mils
13 Min. Hole Dia (NPTH) 0.25±2mils
14 Max/Min Soldermask Thickness 2mil/0.5mil (50um/12.7um)
15 Min Slot 0.8mm×1mm

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