PCBA Capability

No. Item Process Capability Parameter
1 Order Quantity More than 1pcs
2 PCB Type Rigid PCB, FPC, Rigid-flex PCB
3 Assembly Tech SMT, THT, Mixed Tech or POP
4 Component Sourcing Full Turnkey, Partial Turnkey, Consigned
5 PCB Size 45*45mm — 510*500mm
6 BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
7 Parts Presentation Tape, Reel, Stick or Tray
8 Wire & Cable Wire harness and Cable Assembly
9 Quality Inspection Visual, SPI, FAI, AOI; X-RAY checking
10 Mounting Accuracy ±0.035mm (±0.025mm)
11 Min Package 01005 (0.4mm*0.2mm)
12 Conformal Coating Available by machine
13 IC Inspection Function, Electrical or Decap Test
14 Lead Time 3 days – 5 Weeks
15 Other Techniques Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom,
Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework,
Shield cover assembly for EMI emission control

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PCB Capability

Item Standard PCB Customized PCB
Number of Layers 2-20 2-50
Material FR4 Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers etc.
PCB thickness 0.4-3.2mm 0.4-6.4mm
Copper Weight HOZ-3OZ HOZ-10OZ
Min. Hole Diameter 0.3mm 0.1mm by Laser Drill
PCB Size Min. 6.00X6.00mm Max. 600.00X620.00mm
PCB Finish HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Min.Soldermask Dam. 4mils for 1OZ 2.5mils for 1OZ
Prepreg Type 2116,1080 2116,1080,7628,3313,106
Min.Width/Space 4/4 mils 2.5/2.5 mils
Min. Annular Ring 4/4 mils 2.5/2.5 mils
Aspect Ratio 8:1 15:1
Lead Time 2 weeks 5 Days - 5 Weeks
Impedance Tolerance ±5% - ±10% ±5% - ±10%
Other Techniques Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon Mask, Countersink hole,
Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad (VIP, POFV), Multi-finishes on one PCB

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PCBA Capability

No. Item Process Capability Parameter
1 Order Quantity More than 1pcs
2 PCB Type Rigid PCB, FPC, Rigid-flex PCB
3 Assembly Tech SMT, THT, Mixed Tech or POP
4 Component Sourcing Full Turnkey, Partial Turnkey, Consigned
5 PCB Size 45*45mm -- 510*500mm
6 BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
7 Parts Presentation Tape, Reel, Stick or Tray
8 Wire & Cable Wire harness and Cable Assembly
9 Quality Inspection Visual, SPI, FAI, AOI; X-RAY checking
10 Mounting Accuracy ±0.035mm (±0.025mm)
11 Min Package 01005 (0.4mm*0.2mm)
12 Conformal Coating Available by machine
13 IC Inspection Function, Electrical or Decap Test
14 Lead Time 3 days - 5 Weeks
15 Other Techniques Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom,
Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework,
Shield cover assembly for EMI emission control

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FPC Capability

No. Item Process Capability Parameter
1 Layer Count 1-8 Layers
2 FPC Material PI, PET, PEN, FR-4
3 Final Thickness 0.06-4.0mm
4 Board Size 250.00X1200mm
5 Copper Foil 12um,18um,35um,70um
6 Min width/Space 3mil/3mil
7 Holewall Copper Thickness 8-20μm
8 Surface Treatment HAL leadfree, ENIG, Immersion Silver/Tin, OSP
9 Outlines Dimension ±2mils
10 Solder Heat Resistance 280℃ / 10secs
11 Stiffener Type PI, FR4, Stainless Steel, Aluminum
12 Min. Hole Dia (PTH) 0.1mm±3mils
13 Min. Hole Dia (NPTH) 0.25±2mils
14 Max/Min Soldermask Thickness 2mil/0.5mil (50um/12.7um)
15 Min Slot 0.8mm×1mm

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