8-레이어 FR4 PCB: The Core Board for Industrial Communication

This 8-layer FR4 PCB is specifically engineered for demanding industrial communication applications, providing a stable and reliable foundation for industrial control cabinets, communication gateways, and automation systems. 치수와 함께 174.52×121.25mm and a thickness of 1.6mm, the board balances mechanical stability with the ability to integrate a large number of critical components. From excellent signal integrity to a durable build, this PCB is designed to deliver reliable performance in harsh environments with vibration, temperature fluctuations, 및 전자기 간섭.

주요 기술적 기능

1. Advanced Stackup and Signal Integrity

• 8-레이어 스택 업: The design features four signal layers and four power/ground planes. This architecture effectively suppresses EMI (Electromagnetic Interference) and provides optimized routing paths for high-speed differential pairs like Ethernet and CANopen.
• 정밀 임피던스 제어: Differential line impedance is controlled at 100Ω±8%, while single-ended line impedance is controlled at 50Ω±8%. This minimizes signal reflection and ensures the integrity of high-speed interfaces like Gigabit Ethernet.
• 1온스 (35μm) 구리 두께: The copper thickness balances the needs of fine-line routing (최소 선/공간: 75μm/75μm) with a high current-carrying capacity of up to 10A, supporting high-power and high-density designs.

2. Industrial-Grade Design and Manufacturing

• 동의하다 (전기 전기 니켈 몰입 금) 표면 마감: The finish provides a nickel layer of 4–6μm and a gold layer of 0.05–0.1mm. The nickel layer offers excellent corrosion resistance, while the gold layer ensures long-term solderability and wire bonding compatibility, guaranteeing reliable, long-lasting connections.
• 블루 LPI 솔더 마스크: The blue ink not only effectively protects circuitry and prevents oxidation but also provides excellent visual differentiation in complex systems, making identification and maintenance easier.
• Mixed Assembly Compatibility: The board supports both smt (Surface-Mount Technology) for high-density ICs (예를 들어, PHY chips, FPGA) 그리고 담그다 (Dual In-line Package) for rugged connectors (RJ45, DB25) 그리고 릴레이, combining high integration with durability.
• High-Precision Manufacturing: We use LDI (레이저 직접 이미징) technology for 75μm trace accuracy. The electrolytic copper plating process ensures thickness uniformity within ±5%, guaranteeing consistent trace performance.

Quality and Compliance

• Comprehensive Quality Control:
  • 100% Electrical Testing (e- 테스트): This ensures the continuity of all circuits during the manufacturing stage.
  • 자동화 된 광학 검사 (AOI): Used to detect defects on the bare board, such as shorts and opens.
  • X-ray Inspection: Verifies the solder joint quality of BGA packages to ensure there are no voids or bridges.
• Environmental and Industry Standards:
  • Compliant with the IPC-6012 클래스 2 standard for industrial applications.
  • RoHS/REACH certified, adhering to hazardous substance restrictions.
  • ISO 9001:2015 certified, providing a guarantee of our quality management system.

Typical Applications

• Industrial Ethernet Networks: Provides a low-latency, low-jitter high-speed transmission platform for 10/100/1000Mbps Ethernet communication.
• PLC & SCADA Systems: Supports real-time data exchange and control in manufacturing facilities.
• Railway Communication Systems: Compliant with the EN 50155 기준, ensuring stable operation in harsh rail environments.
• Wireless Base Stations: Provides reliable RF signal routing for 5G sub-6GHz and Wi-Fi 6 응용 프로그램.

With its precise stackup design, superior electrical performance, and robust industrial-grade features, this PCB is the ideal choice for building high-performance, highly reliable industrial communication systems.