This 2-layer FR4 PCB balances space efficiency with robust performance for industrial control modules, sensor nodes, and low-power automation systems. 치수와 함께 98.45×79.69mm 그리고 a 1.6MM 두께, the board offers a versatile platform for integrating microcontrollers, 통신 인터페이스, and power components in a compact form factor. Constructed from FR4 material, it ensures stable electrical insulation (유전 상수 εR = 4.5) 그리고 기계적 강성, suitable for operation in moderate-temperature industrial environments.

레이어 아키텍처 & Electrical Design

  • 2-레이어 스택 업:
    • Top and bottom signal layers with ground/power planes implemented via copper pours for basic EMI suppression.
    • Split power domains (예를 들어, 5v/3.3v) separated by isolation traces to minimize cross .
  • 1온스 (35μm) 구리 두께:
    • Supports up to 8A current in power traces (≥1mm width) and fine-line routing (min line/space: 100µm/100mm) for signal integrity.
    • Copper pour areas on both layers reduce thermal hotspots in power-critical sections.

Industrial-Grade Features

  • 녹색 LPI 솔더 마스크:
    • Standard industrial color for easy visual inspection and component identification.
    • Chemical resistance against common industrial contaminants and cleaning agents.
  • ENIG 표면 마감:
    • 3–5μm nickel layer prevents corrosion; 0.05–0.1μm 금 층은 SMT 및 딥 구성 요소 모두에 대한 안정적인 솔더 조인트.
  • SMT+DIP Mixed Assembly:
    • smt: Accommodates 0402 수동 구성 요소, SOIC/SSOP ICs, and 0.5mm pitch QFP packages.
    • 담그다: Supports through-hole connectors (예를 들어, 0.1″ headers, 터미널 블록) and relays for field wiring.

조작 & 품질 관리

  • 정밀 제조:
    • 레이저 직접 이미징 (LDI) for 100μm trace accuracy; electrolytic copper plating with uniform thickness verification.
    • V-cut scoring for optional panelization in high-volume orders.
  • Rigorous Testing:
    • 100% 자동화 된 광학 검사 (AOI) 솔더 마스크 커버리지 및 실크 스크린 선명도 용.
    • 전기 연속성을위한 비행 프로브 테스트 (≤0.1o) 그리고 격리 (≥100mΩ).
    • 열 응력 테스트 (260° C 반사 사이클) to ensure solder joint reliability.
  • 표준 준수:
    • IPC-6012 클래스 2 산업 전자 제품; ROHS/REACH REACH는 무연 제조를 준수합니다.

산업 응용 분야

  • Industrial Sensor Nodes:
    온도/습도 센서를 통합합니다, analog-to-digital converters, 무선 모듈 (Zigbee/Bluetooth).
  • Motor Driver Modules:
    Manages low-voltage DC motors with PWM control, current sensing, and overheat protection.
  • 통신 인터페이스:
    Enables RS-232/485 to USB conversion or simple protocol bridges for legacy industrial equipment.
  • Power Distribution Blocks:
    Distributes 24V DC to multiple loads with circuit protection and status indication.