This compact 2-layer FR4 PCB is engineered for miniature electronic devices that demand a balance of reliability, conductivity, and cost-effectiveness, such as wearable technology, IoT sensors, and medical diagnostics. Avec des dimensions de 15.60mm×6.40mm et un 1.0mm d'épaisseur, the board maximizes space efficiency while maintaining mechanical stability for surface-mount component assembly. Construit à partir de Matériau FR4, it offers consistent electrical insulation (constante diélectrique εr = 4,5) and thermal resistance suitable for commercial-grade applications.
Le 1.5Oz (52μm) épaisseur de cuivre on both layers optimizes current-carrying capacity (up to 10A per wide trace) while minimizing board weight—ideal for battery-powered devices where power density and longevity are critical. Le Blue LPI (Liquid Photoimageable) solder mask provides a durable, moisture-resistant coating that protects circuitry from environmental damage, Pendant que le Écran à soigneux blanc ensures clear component marking on the miniature surface, aiding assembly and maintenance in tight layouts. Le HASL (Hot Air Solder Leveling) surface finish creates a uniform, solder-friendly coating of eutectic tin-lead (or lead-free SAC alloy), promoting reliable soldering even for fine-pitch components (down to 0.5mm pitch).
Manufactured in a 10×10 panel format, the PCB enables cost-effective mass production by minimizing material waste and streamlining pick-and-place assembly. Each panel contains 100 identical boards, connected by micro-vias or breakaway tabs for easy depaneling without damaging delicate circuitry. This format is ideal for OEMs requiring high-volume production of miniature devices, such as wireless modules or sensor nodes.
- Fine-Line Routing:
- Minimum line width/space: 60μm/60μm, achieved via laser direct imaging (LDI) for precise trace definition.
- HASL Process Control:
- Lead-free SAC305 alloy (96.5Sn/3.0Ag/0.5Cu) with immersion time <5 seconds to prevent copper oxidation.
- Assurance qualité:
- 100% AOI (Inspection optique automatisée) for solder mask coverage and silkscreen accuracy.
- Test de sonde volante pour la continuité électrique, ensuring <0.1Ω resistance on all traces.
- Thermal Stability:
- Withstands reflow temperatures up to 260°C (lead-free process), verified by thermal cycling tests (-40°C to +85°C for 1,000 cycles).
- Wearable Electronics:
Powers fitness trackers, smartwatches, and health monitors with compact circuitry and low-profile design.
- IoT Sensors:
Enables battery-powered environmental sensors (temperature, humidity, air quality) for smart buildings or agriculture.
- Dispositifs médicaux:
Supports miniature diagnostic tools or wearable patient monitors, where size and reliability are critical.
- Wireless Modules:
Houses RF circuitry for Bluetooth, Wi-Fi, or Zigbee modules in consumer electronics and industrial automation.
By choosing this 2-layer FR4 PCB, engineers gain a miniature solution that balances 1.5OZ copper performance, blue solder mask durability, and HASL solderability. The 10×10 panel format ensures cost-effective scaling from prototype to mass production, while the compact dimensions enable integration into the smallest electronic devices. Soutenu par ISO 9001:2015 certification and IPC-6012 Class 2 compliance, this PCB delivers consistent quality for applications where space, cost, and reliability are non-negotiable.
