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PCB Capability

Item	Standard PCB	Customized PCB
Number of Layers	2-20	2-50
Material	FR4	Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers etc.
PCB thickness	0.4-3.2mm	0.4-6.4mm
Copper Weight	HOZ-3OZ	HOZ-10OZ
Min. Hole Diameter	0.3mm	0.1mm by Laser Drill
PCB Size	Min. 6.00X6.00mm Max. 600.00X620.00mm
PCB Finish	HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Min.Soldermask Dam.	4mils for 1OZ	2.5mils for 1OZ
Prepreg Type	2116,1080	2116,1080,7628,3313,106
Min.Width/Space	4/4 mils	2.5/2.5 mils
Min. Annular Ring	4/4 mils	2.5/2.5 mils
Aspect Ratio	8:1	15:1
Lead Time	2 weeks	5 Days - 5 Weeks
Impedance Tolerance	±5% - ±10%	±5% - ±10%
Other Techniques	Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon Mask, Countersink hole, Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad (VIP, POFV), Multi-finishes on one PCB

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PCBA Capability

No.	Item	Process Capability Parameter
1	Order Quantity	More than 1pcs
2	PCB Type	Rigid PCB, FPC, Rigid-flex PCB
3	Assembly Tech	SMT, THT, Mixed Tech or POP
4	Component Sourcing	Full Turnkey, Partial Turnkey, Consigned
5	PCB Size	4545mm -- 510500mm
6	BGA Package	BGA Dia. 0.14mm, BGA 0.2mm pitch
7	Parts Presentation	Tape, Reel, Stick or Tray
8	Wire & Cable	Wire harness and Cable Assembly
9	Quality Inspection	Visual, SPI, FAI, AOI; X-RAY checking
10	Mounting Accuracy	±0.035mm (±0.025mm)
11	Min Package	01005 (0.4mm*0.2mm)
12	Conformal Coating	Available by machine
13	IC Inspection	Function, Electrical or Decap Test
14	Lead Time	3 days - 5 Weeks
15	Other Techniques	Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom, Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework, Shield cover assembly for EMI emission control

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FPC Capability

No.	Item	Process Capability Parameter
1	Layer Count	1-8 Layers
2	FPC Material	PI, PET, PEN, FR-4
3	Final Thickness	0.06-4.0mm
4	Board Size	250.00X1200mm
5	Copper Foil	12um,18um,35um,70um
6	Min width/Space	3mil/3mil
7	Holewall Copper Thickness	8-20μm
8	Surface Treatment	HAL leadfree, ENIG, Immersion Silver/Tin, OSP
9	Outlines Dimension	±2mils
10	Solder Heat Resistance	280℃ / 10secs
11	Stiffener Type	PI, FR4, Stainless Steel, Aluminum
12	Min. Hole Dia (PTH)	0.1mm±3mils
13	Min. Hole Dia (NPTH)	0.25±2mils
14	Max/Min Soldermask Thickness	2mil/0.5mil (50um/12.7um)
15	Min Slot	0.8mm×1mm

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