8-layer FR4 PCB is designed for mission-critical industrial communication applications, where robust signal transmission, electromagnetic compatibility (EMC), and durable construction are essential. Mit Dimensionen von 174.52×121.25mm und a 1.6mm Dicke, the board balances large-scale component integration with mechanical stability for industrial control cabinets, communication gateways, and automation systems. Gebaut von FR4 -Material, Es bietet eine stabile elektrische Isolierung (Dielektrizitätskonstante εr = 4,5) und mechanische Stärke, suitable for operation in environments with vibration, Temperaturschwankungen, und elektromagnetische Störung.
- 8-Layer Stackup:
- 4 Signalschichten + 4 power/ground planes for efficient EMI suppression
- Inner layers optimized for differential pair routing (Z.B., Ethernet, CANopen)
- 1Oz (35μm) Copper Thickness:
- Balances fine-line routing (Mindestlinie/Raum: 75μm/75μm) with current-carrying capacity (up to 10A per trace)
- Precision Impedance Control:
- 50Ω ±8% for microstrip/stripline configurations
- Minimizes signal reflection in high-speed interfaces (10G Ethernet, PROFIBUS)
- Blue LPI Solder Mask:
- Provides visual differentiation in complex systems
- Superior chemical resistance against industrial contaminants
- ENIG Surface Finish:
- 3–5μm nickel layer for corrosion resistance
- 0.05–0.1μm gold layer for long-term solderability and wire bonding compatibility
- Mixed SMT+DIP Assembly:
- SMT support for high-density ICs (Z.B., PHY chips, FPGAs)
- DIP compatibility for rugged connectors (RJ45, DB25) and relays
- Erfindung der hohen Präzision:
- Laser Direct Imaging (LDI) for 75μm trace accuracy
- Electrolytic copper plating with ±5% thickness uniformity
- Comprehensive Testing:
- 100% AOI inspection for solder mask and silkscreen quality
- X-ray verification of BGA vias
- Impedance testing per layer to ensure signal integrity
- Environmental Compliance:
- IPC-6012 Class 2 for industrial applications
- RoHS/REACH compliant for hazardous substance restrictions
- Thermal cycling tested (-40° C bis +85 ° C., 1,000 Zyklen)
- Industrial Ethernet Networks:
Supports 10/100/1000Mbps Ethernet with minimal latency and jitter
- Wireless Base Stations:
Enables RF signal routing for 5G sub-6GHz and Wi-Fi 6 applications
- PLC & SCADA Systems:
Facilitates real-time data exchange in manufacturing plants
- Railway Communication Systems:
Meets EN 50155 environmental standards for rolling stock applications
By integrating 8-layer signal isolation, 1OZ copper conductivity, und Rätselbeheblichkeit, this PCB delivers uncompromised performance in demanding industrial communication environments. The blue solder mask offers visual distinction in complex setups, while mixed SMT/DIP assembly supports both high-density digital components and robust field connections. Unterstützt von ISO 9001:2015 certification, it provides the foundation for reliable industrial communication systems requiring both speed and durability.
