This compact 2-layer FR4 PCB is engineered for miniature electronic devices that demand a balance of reliability, Leitfähigkeit, and cost-effectiveness, such as wearable technology, IoT sensors, and medical diagnostics. Mit Dimensionen von 15.60mm×6.40mm und a 1.0mm Dicke, the board maximizes space efficiency while maintaining mechanical stability for surface-mount component assembly. Gebaut von FR4 -Material, it offers consistent electrical insulation (Dielektrizitätskonstante εr = 4,5) and thermal resistance suitable for commercial-grade applications.
Der 1.5Oz (52μm) Kupferdicke on both layers optimizes current-carrying capacity (up to 10A per wide trace) while minimizing board weight—ideal for battery-powered devices where power density and longevity are critical. Der Blue LPI (Liquid Photoimageable) solder mask Bietet eine langlebige, moisture-resistant coating that protects circuitry from environmental damage, während die Weißer Siebdruck ensures clear component marking on the miniature surface, aiding assembly and maintenance in tight layouts. Der Bluten (Hot Air Solder Leveling) surface finish creates a uniform, solder-friendly coating of eutectic tin-lead (or lead-free SAC alloy), promoting reliable soldering even for fine-pitch components (down to 0.5mm pitch).
Manufactured in a 10×10 panel format, the PCB enables cost-effective mass production by minimizing material waste and streamlining pick-and-place assembly. Each panel contains 100 identical boards, connected by micro-vias or breakaway tabs for easy depaneling without damaging delicate circuitry. This format is ideal for OEMs requiring high-volume production of miniature devices, such as wireless modules or sensor nodes.
- Fine-Line Routing:
- Minimum line width/space: 60μm/60μm, achieved via laser direct imaging (LDI) for precise trace definition.
- HASL Process Control:
- Lead-free SAC305 alloy (96.5Sn/3.0Ag/0.5Cu) with immersion time <5 seconds to prevent copper oxidation.
- Qualitätssicherung:
- 100% Aoi (Automatisierte optische Inspektion) for solder mask coverage and silkscreen accuracy.
- Flying probe testing for electrical continuity, ensuring <0.1Ω resistance on all traces.
- Thermal Stability:
- Withstands reflow temperatures up to 260°C (lead-free process), verified by thermal cycling tests (-40°C to +85°C for 1,000 Zyklen).
- Wearable Electronics:
Powers fitness trackers, smartwatches, and health monitors with compact circuitry and low-profile design.
- IoT Sensors:
Enables battery-powered environmental sensors (temperature, humidity, air quality) for smart buildings or agriculture.
- Medizinprodukte:
Supports miniature diagnostic tools or wearable patient monitors, where size and reliability are critical.
- Wireless Modules:
Houses RF circuitry for Bluetooth, Wi-Fi, or Zigbee modules in consumer electronics and industrial automation.
By choosing this 2-layer FR4 PCB, engineers gain a miniature solution that balances 1.5OZ copper performance, blue solder mask durability, and HASL solderability. The 10×10 panel format ensures cost-effective scaling from prototype to mass production, while the compact dimensions enable integration into the smallest electronic devices. Unterstützt von ISO 9001:2015 Zertifizierung und IPC-6012-Klasse 2 Einhaltung, this PCB delivers consistent quality for applications where space, kosten, and reliability are non-negotiable.
