This 12-layer HDI PCB redefines high-density electronic integration, combining FR4 TG180 material with complex blind via structures to enable next-generation device miniaturization. The FR4 TG180 substrate (glass transition temperature 180°C) ensures thermal stability in high-power applications, while the 2.0mm thickness balances mechanical rigidity with layered routing complexity. The board’s 12-layer architecture supports a mix of signal, power, and ground planes, optimized for high-speed digital signals and dense BGA component placement.
- Multi-Level Blind Vias:
- L1-L3 & L1-L4: Top-layer blind vias enable direct connection to inner signal layers, reducing via stub length for 5G and RF applications.
- L7-L12 & L9-L12: Bottom-layer blind vias support backside component routing, critical for 3D package-on-package (PoP) designs.
- 0.2mm Microvia Precision:
Laser-drilled vias with ±10μm accuracy, filled with conductive epoxy and plated to create airtight connections—eliminating voids in high-reliability scenarios.
- Sequential Lamination Process:
- Core layers (L1-L12) laminated in stages with semi-additive processing (SAP) for 5μm trace resolution.
- Build-up layers added via electroless copper plating for fine-pitch routing (40μm line/space).
- ENIG Surface Finish:
- Nickel: 3-5μm for corrosion resistance
- Gold: 0.05-0.1μm for long-term solderability and wire bond compatibility
- Thermal Management:
Thermal vias connecting power planes to outer layers, reducing hotspots in high-current sections (e.g., DC-DC converters).
- Aerospace Avionics:
Supports MIL-STD-202 environmental testing for vibration (20-2000Hz) and temperature (-55°C to +125°C).
- Medical Imaging Devices:
Low-loss dielectric properties (Dk=4.5, tanδ=0.02) minimize signal distortion in MRI or ultrasound equipment.
- 5G Base Stations:
Impedance-controlled layers (50Ω ±8%) for mmWave antenna arrays and high-speed data interfaces.
- 3D AOI Inspection:
Verifies blind via registration and solder mask coverage on all 12 layers.
- X-Ray Tomography:
Confirms internal via integrity and layer alignment with <50μm tolerance.
- Standards Met:
- IPC-6012 Class 3 for mission-critical applications
- RoHS/REACH compliant for lead-free manufacturing
