4-layer FR4 TG150 PCB is engineered for applications requiring a balance of high-current capability, signal integrity, and cost-effective manufacturing, such as industrial control systems, automotive modules, and power supplies. Constructed from FR4 TG150 material (glass transition temperature 150°C), the PCB offers stable electrical performance and mechanical durability in moderate-temperature environments. The 2.0mm thickness provides robust structural support for heavy components or applications subject to vibration, while the 4-layer architecture (2 signal layers + 2 power/ground planes) minimizes electromagnetic interference (EMI) and enables efficient power distribution.
The 2OZ (70μm) copper thickness on all layers supports high-current loads (up to 15A per trace), making it ideal for power-hungry circuits like motor drivers, LED controllers, and battery management systems. Designed in a 1×2 panel format, the PCB optimizes production for medium-volume orders, reducing material waste and simplifying assembly. Each panel contains two identical boards, connected by breakaway tabs for easy depaneling without damaging circuitry.
The Green LPI solder mask protects the copper traces from environmental damage (moisture, chemicals, and oxidation), while the White silkscreen ensures clear component marking and reference designations for assembly and maintenance. The ENIG (Electroless Nickel Immersion Gold) surface treatment enhances solderability with a smooth, corrosion-resistant finish: the nickel layer (3–5μm) adds durability, and the gold layer (0.05–0.1μm) prevents oxidation, maintaining reliable connections over the product lifecycle.
Manufacturing processes focus on precision and quality control:
- DFM analysis optimizes layer stacking and panelization to ensure uniform copper distribution and minimal thermal stress.
- Electrolytic copper plating achieves consistent 2OZ thickness across all layers, verified by cross-sectional analysis.
- 100% AOI (Automated Optical Inspection) checks for solder mask defects, silkscreen clarity, and surface imperfections.
- Electrical testing verifies continuity and isolation resistance, meeting IPC-6012 Class 2 standards.
- Thermal stress testing (reflow cycles at 260°C) ensures the PCB withstands harsh assembly conditions.
Engineers will appreciate the PCB’s versatility in handling both power and signal applications. In industrial settings, it supports complex control panels with mixed high-current and low-voltage signals. In automotive systems, the TG150 material and ENIG finish ensure reliability in under-hood environments. For consumer electronics, the 1×2 panel format balances production efficiency with design flexibility for power adapters and charging modules.
By choosing this 4-layer FR4 TG150 PCB, customers gain a solution that merges 2OZ copper performance, panelized manufacturing, and ENIG reliability. Backed by ISO 9001:2015 certification and RoHS compliance, it delivers consistent quality from prototype to mass production—an ideal choice for projects requiring robust power handling, cost-effective scaling, and long-term operational stability.
