BMS board revolutionizes drone charging station management by integrating precise power control, multi-protocol communication, and intelligent battery management, ideal for commercial drone fleets, logistics hubs, and autonomous aerial systems. The core design emphasizes eight 3A constant voltage constant current outputs, each optimized for parallel charging of drone batteries while maintaining charge consistency and efficiency. The constant voltage (CV)/constant current (CC) charging control automatically switches between charging phases: CC mode for rapid charging at 3A until the battery approaches full capacity, then CV mode to maintain voltage stability and prevent overcharging—critical for extending lithium battery lifespan in high-turnover drone operations.

Key Technical Features

  • Multi-Protocol Communication:
    • RS485: Enables long-range (up to 1.2km) communication for central monitoring of multiple charging stations.
    • Serial port (UART): Supports direct connection to drone docking systems for real-time charge status updates.
    • USB interface: Allows local configuration via PC software, the firmware updates, and data logging.
  • 8-Channel 3A Power Output:
    • Independent PWM control for each channel, achieving ±1% current/voltage accuracy.
    • Support for 12-24V input voltage, compatible with common drone battery chemistries (LiPo, Li-ion).
  • Comprehensive Power Management:
    • Overcurrent protection: Instantaneous shutdown at >3.3A per channel to prevent short circuits.
    • Overvoltage/undervoltage protection: Monitors each battery voltage, disconnecting when outside safe range (e.g., <2.5V or >4.35V for LiPo).
    • Thermal management: Built-in NTC thermistors detect overheating (≥75°C), reducing output current to prevent thermal runaway.
  • Voltage Monitoring & Balance Management:
    • 16-bit ADC for real-time voltage sampling (resolution: 1mV) across all channels.
    • Active cell balancing (100mA per cell) to equalize battery packs, minimizing capacity degradation over cycles.

Industrial-Grade Design for Drone Stations

  • Rugged Hardware:
    • 4-layer FR4 PCB with 1.6mm thickness and 2OZ copper for low impedance and heat dissipation.
    • Metal heat sink on power MOSFETs to maintain <40°C temperature rise under full load.
  • EMI/EMC Compliance:
    • Meets FCC Part 15 Class B for electromagnetic emissions, suitable for indoor drone hubs.
    • Transient protection (TVS diodes) on all communication ports to withstand electrostatic discharge (ESD).
  • Reliability Features:
    • Redundant power input (DC 12-24V + optional UPS backup) for uninterrupted charging.
    • Battery-backed real-time clock (RTC) to log charging events during power outages.

System Integration & Software

  • API & Protocol Support:
    • Modbus RTU over RS485 for integration with SCADA systems.
    • Custom JSON API over USB for drone fleet management software (e.g., scheduling charging cycles, prioritizing high-priority drones).
  • Monitoring Dashboard:
    • Web-based interface displays real-time charge status, historical data, and alarm notifications (e.g., failed charging channel, unbalanced battery).

Drone Charging Station Applications

  • Logistics & Delivery Drones:
    Manages charging for fleets in distribution centers, ensuring quick turnaround for package delivery.
  • Agricultural Drones:
    Enables 24/7 charging for crop monitoring drones in remote farms, with SMS alerts for maintenance needs.
  • Security & Surveillance Drones:
    Maintains ready-to-fly batteries for drones patrolling industrial sites or urban areas.
  • Emergency Response Drones:
    Prioritizes charging for medical supply or search-and-rescue drones, with priority charging queues.

 

By integrating 8-channel CC/CV charging, multi-interface communication, and robust protection features, this BMS board ensures efficient, safe drone battery management in high-demand environments. Its combination of precision power control, real-time monitoring, and industrial reliability makes it a strategic choice for drone operators seeking to optimize fleet uptime and battery lifespan. Backed by a 2-year warranty and 24/7 technical support, the board simplifies integration into existing charging station infrastructure while enabling future upgrades for evolving drone technologies.

PCB Capability


Item Standard PCB Customized PCB
Number of Layers 2-20 2-50
Material FR4 Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers etc.
PCB thickness 0.4-3.2mm 0.4-6.4mm
Copper Weight HOZ-3OZ HOZ-10OZ
Min. Hole Diameter 0.3mm 0.1mm by Laser Drill
PCB Size Min. 6.00X6.00mm Max. 600.00X620.00mm
PCB Finish HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Min.Soldermask Dam. 4mils for 1OZ 2.5mils for 1OZ
Prepreg Type 2116,1080 2116,1080,7628,3313,106
Min.Width/Space 4/4 mils 2.5/2.5 mils
Min. Annular Ring 4/4 mils 2.5/2.5 mils
Aspect Ratio 8:1 15:1
Lead Time 2 weeks 5 Days - 5 Weeks
Impedance Tolerance ±5% - ±10% ±5% - ±10%
Other Techniques Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon Mask, Countersink hole,
Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad (VIP, POFV), Multi-finishes on one PCB

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PCBA Capability


No. Item Process Capability Parameter
1 Order Quantity More than 1pcs
2 PCB Type Rigid PCB, FPC, Rigid-flex PCB
3 Assembly Tech SMT, THT, Mixed Tech or POP
4 Component Sourcing Full Turnkey, Partial Turnkey, Consigned
5 PCB Size 45*45mm -- 510*500mm
6 BGA Package BGA Dia. 0.14mm, BGA 0.2mm pitch
7 Parts Presentation Tape, Reel, Stick or Tray
8 Wire & Cable Wire harness and Cable Assembly
9 Quality Inspection Visual, SPI, FAI, AOI; X-RAY checking
10 Mounting Accuracy ±0.035mm (±0.025mm)
11 Min Package 01005 (0.4mm*0.2mm)
12 Conformal Coating Available by machine
13 IC Inspection Function, Electrical or Decap Test
14 Lead Time 3 days - 5 Weeks
15 Other Techniques Box Build Assembly, IC programming, Components cost-down, Function & aging test as custom,
Press fit assembly, SAC305 or better Solder Paste used, BGA reballing or rework,
Shield cover assembly for EMI emission control

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FPC Capability


No. Item Process Capability Parameter
1 Layer Count 1-8 Layers
2 FPC Material PI, PET, PEN, FR-4
3 Final Thickness 0.06-4.0mm
4 Board Size 250.00X1200mm
5 Copper Foil 12um,18um,35um,70um
6 Min width/Space 3mil/3mil
7 Holewall Copper Thickness 8-20μm
8 Surface Treatment HAL leadfree, ENIG, Immersion Silver/Tin, OSP
9 Outlines Dimension ±2mils
10 Solder Heat Resistance 280℃ / 10secs
11 Stiffener Type PI, FR4, Stainless Steel, Aluminum
12 Min. Hole Dia (PTH) 0.1mm±3mils
13 Min. Hole Dia (NPTH) 0.25±2mils
14 Max/Min Soldermask Thickness 2mil/0.5mil (50um/12.7um)
15 Min Slot 0.8mm×1mm

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