PCB Capability

Item
Standard PCB
Customized PCB
Number of Layers
2L-20L
2L-50L
Material
FR4
Hi Speed material from Taiwan Union, SY Tech, High Frequency material from Rogers
etc.
PCB thickness
0.4-3.2mm
0.4-6.4mm
Copper Weight
HOZ-3OZ
HOZ-10OZ
Min. Hole Diameter
0.3mm
0.1mm (by Laser Drill)
PCB Size
Min. 6.00X6.00mm
Max. 600.00X620.00mm
Min.Soldermask Dam.
4mils for 1OZ
2.5mils for 1OZ
Prepreg Type
21,161,080
2,116,108,076,283,310,000
Min.Width/Space
4/4 mils
2.5/2.5 mils
Min. Annular Ring
4/4 mils
2.5/2.5 mils
Aspect Ratio
8:1
15:1
Lead Time
2 weeks
5 Days – 5 Weeks
Impedance Tolerance
±5% – ±10%
±5% – ±10%
PCB Finish
HAL, HAL-leadfree, ENIG, ENEPIG, Immersion Tin, Immersion Silver, OSP
Other Techniques
Gold fingers, Blind and Buried Holes, Peelable solder mask, Edge plating, Carbon
Mask, Countersink hole, Half/Castellated hole, Press fit hole, Via plugged/filled with resin, Via in pad
(VIP, POFV), Multi-finishes on one PCB
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