The world’s slimmest printed circuit board has been developed.
Dai Nippon Printing Co., Ltd. (DNP) has developed the world’s slimmest printed board, with built-in passive components, such as IC chips, condensers and resisters.
The newly developed printed board employs B2it and by making improvements to the base plate and wiring materials, has succeeded in reducing the thickness of the printed board to 0.45 mm from the 0.65 mml.Sample shipments will begin in February.
Developmental Background
Digital equipment, including mobile phones, notebook PCs, digital cameras and car navigation systems, are moving in the direction of higher performance, as well as facing increased needs for slimmer and more compact devices, which, in turn, is fueling demands for improvements in the parts used in this equipment.
Overview of the New Printed Board
B2it technology has a three-dimensional structure, composed of IC chips, such as LSI, and passive components mounted in the base plate, and on the surface to facilitate downsizing and higher density. As it is also possible to freely arrange the connection points between the layers, IC chips and passive components in the base plate and parts on the surface of the plate can be connected over the shortest possible course, which in addition to stabilizing IC chip movements also improves reliability as a module.
By altering base plate and wiring materials, and being creative with the positioning of the built-in parts and wiring, DNP has successfully slimmed down the product profile by 30%, compared to existing products, to 0.45 mm.
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