Taiwan’s PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin notebooks based on Intel’s CULV (consumer ultra low votage) CPUs.
Upcoming notebooks incorporating CULV CPUs are expected to spur demand for HDI boards, said the makers, adding [...]

The upcoming launch of Intel’s consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for high-density interconnect (HDI) boards, according to Taiwan’s PCB makers. Companies including Unimicron Technology, HannStar Board, Gold Circuit Electronics (GCE) and Dynamic Electronics have been vying for HDI board orders for new ultra-thin [...]