Call for Papers 2009 EIPC Summer Conference in Austria
The European Institute of Printed Circuits (EIPC) is inviting companies and individuals in the PCB manufacturing and supply industries to submit abstracts for the next Conference, June 18-19, 2009, in St. Michael, Lungau, Austria.
The EIPC Summer in Austria with a theme “Cost Reduction through Innovation” will highlight New PCB-technology focused on energy conservation.
Background:
The global electronics [...]




