The upcoming launch of Intel’s consumer ultra-low voltage (CULV) CPUs, which target ultra-portable notebooks priced between US$699-899, will help significantly increase demand for high-density interconnect (HDI) boards, according to Taiwan’s PCB makers. Companies including Unimicron Technology, HannStar Board, Gold Circuit Electronics (GCE) and Dynamic Electronics have been vying for HDI board orders for new ultra-thin notebooks. Notebooks incorporating CULV CPUs are expected to hit shelves in April.

Unimicron’s HDI boards used to target handset applications with a penetration rate 10-20%, while penetration in the notebook segment only accounted for 3-5% of Unimicron’s total sales. Unimicron is more aggressively developing the notebook HDI market and forecast the penetration rate of HDI boards in notebooks will increase to 10% this year from 5% in 2008. The company also expects its revenue share of HDI notebook boards to increase in the second quarter.

HannStar Board was conservative about HDI notebook boards because of price pressure. However, as Intel has been launching more cost-effective CPUs, HannStar Board is turning more optimistic about the market outlook. The company expects the penetration rate of HDI notebook boards to reach 5-10% in 2009, and plans to expand its monthly capacity of HDI boards in 2010.

GCE has seen orders for HDI notebook boards increase since February. The segment accounts for 5% of GCE’s total notebook board shipments and the company expects the share to increase in the future.

Dynamic has set up a monthly capacity of 30,000-50,000 square feet for HDI boards in Taiwan and plans to begin volume production in the second quarter.

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