PCB Capability
Technological capability
| Items | Double side | Muli-layers | |
|---|---|---|---|
| Layers | 2 | 4-12 | |
| Copper Thickness | H-10 OZ | H-10 OZ | |
| Material Thickness | 0.20㎜-3.2㎜ | 0.40㎜-3.2㎜ | |
| Min. Line width&spacing | 0.1/0.1㎜ | 0.1/0.1㎜ | |
| Hole Wall Copper Thickness | ≥20.0um | ≥25um | |
| Min. Annul Ring | ≥0.076㎜ | ≥0.076㎜ | |
| Min. Diameter | 0.20㎜ | 0.20㎜ | |
| Hole Diam Tolerance | PTH | ±0.076㎜ | ±0.076㎜ |
| NPTH | ±0.05㎜ | ±0.05㎜ | |
| Hole Position Tolerance | ±0.05㎜ | ±0.05㎜ | |
| Out-lay Tolerance | Routing | ±0.15㎜ | ±0.13㎜ |
| Punching | ±0.15㎜ | ±0.15㎜ | |
| Min. Solder Mask Bridge | 0.10㎜ | 0.10㎜ | |
| Warp and Twist | ≤0.5% | ≤0.5% | |
| Max.finished board area | 560×635㎜ | 560×635㎜ | |
| Surface Treatment | ENTEK/OSP Coating; Gold/Ni Plating; Gold Finger Plating; Chem Ni/Au; Chem.Tin |
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| Solder Mask Hardness | 6H | 6H | |
| Solder Mask Solderability | 245℃×10S | 245℃×10S | |
| Hot Immersion Ability | 288℃×10S | 288℃×10S | |
| Quality inspection standard | IPC-A-600F IPC-ML-950 | ||