Taiwan’s PCB makers expect the shift to high-density interconnect (HDI) boards to help raise the ASPs of notebook PCBs, and are looking forward to the upcoming launch of ultra-thin notebooks based on Intel’s CULV (consumer ultra low votage) CPUs.

Upcoming notebooks incorporating CULV CPUs are expected to spur demand for HDI boards, said the makers, adding that rising shipments of the high-ASP segment will be able to drive up notebook PCB prices and stabilize the ideal price range.

Citing company sources, market watchers estimate PCB makers Unimicron Technology will see the sales contribution from HDI boards grow to 6% this year from 3% in 2008.

HannStar Board has also scheduled to kick off its initial shipments for CULV-based notebooks in the second quarter, and its utilization rate of HDI boards (with a monthly capacity of around 100,000 square feet) has been pushed up signficantly, the watchers said.

Related posts:

1. PCB manufacturers prepare for HDI boards used in the low-cost notebooks
2. PCB makers more sanguine of notebook/netbook market
3. Notebook PCB makers see increased utilization rate and sales in February due to strong netbook demand
4. More notebook PCB manufactures compete in netbook PCB market in 2009
5. Struggling FPCB industry in Japan to assist stabilize ASPs