Challenges of PCB industry from 3G mobile phone
Sharing 2M bandwidth data services is the biggest highlight of 3G cell phone, which enables any user worldwide to achieve the global three-dimensional satellite communications network from land to ocean by small and inexpensive mobile stations, and ensures global roaming users to communicate in any place and any time with proving a wired telephone voice quality, intelligent network services, multimedia, packet radio, entertainment and broadband services.
For the PCB industry，the swift growth of 3G technology also causes the HDI board to adapt the 3G demand to the new technological development. At present 3G communication, 2 + c +2 technology-based, along with the handset function enhancement and the product minification, PCB design is bound to develop towards the second-order, third-order or even more laminated high-density interconnect. Functions of cell phones increased, under the premise of PCB area is basically unchanged, HDI boards for mobile phones have the following trends: First, the basic second-order HDI structure, some even need third-order structure; Second, line width spacing basically about 75um/75um, smaller for 50um/50um; the smallest BGA hole is up to 0.5mm, will soon be 0.4mm;Third, designed for blind hole stack / buried hole needs filling hole plating of copper or resin plug hole to ensure the reliability, interconnection and smoothness of plate surface; Fourth, for micro- blind hole, the diameter of buried hole and welds plate’s getting smaller and smaller, and the density of laser-hole of entire panel is basically in 70,000 ~ 120,000/square feet.
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