Call for Papers 2009 EIPC Summer Conference in Austria
The European Institute of Printed Circuits (EIPC) is inviting companies and individuals in the PCB manufacturing and supply industries to submit abstracts for the next Conference, June 18-19, 2009, in St. Michael, Lungau, Austria.
The EIPC Summer in Austria with a theme “Cost Reduction through Innovation” will highlight New PCB-technology focused on energy conservation.
Background:
The global electronics industry is in a difficult situation in terms of technology and cost pressure as well as with offers of low cost PCBs from Asia. For the PCB fabricators in Europe it is important to understand what options are possible to master present situation and how to regain profitability in PCB fabrication. Working with innovative technologies are some of the options. In addition using energy efficient products and technology will also help to meet profitability goals.
Topics to be included:
Management Session
- Global Market update
- Developments in Asia and how they affect the European PCB market
- Low energy processes and chemicals for PCB fabrication
- Energy-efficient PCB fabrication equipment
Technical Sessions
- Design for manufacturing
- Cost reduction through miniaturisation. What are the options?
- Advancement in surface finishes for PCBs
- Lead Free Soldering - the impact on materials & processes for PCBs
- Environmental concerns: RoHS, WEEE and REACH compliance and the future
- PCB drilling: equipment, tools and know-how for small hole technology
- Materials for the next generation of PCBs
At this year’s Summer Conference, EIPC offers two bonus programmes that will definitely bring added value to the event.
Related posts:
- EIPC Letter: Add Value to PCB Fabricators’ Service Capabilities
- China PCB manufacturer Fully Hong has announced to significantly reduce its workforce in Europe.
- The European PCB Industry’s Tactics for Survival
- How to Reduce Risks and Successfully Purchase PCBs in China
- European PCB market better than others




